Diodes Incorporated — Analog and discrete power solutions
X3 DFN0603 2

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. X3-DFN0603-2

X3 DFN0603 2

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. X3-DFN0603-2

X3 DFN0603 2

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. X3-DFN0603-2

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D5V0Q1B2LP3

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Description

The SDM2U30CSP is a 30-volt 2A Schottky Barrier Rectifier that is optimized for low forward voltage drop and low leakage current, housed in a compact chip scale package (CSP) that occupies only 1.28 mm2 board-space with low profile. The low thermal resistance enables designers to meet design challenges of increasing efficiency whilst at the same time reducing board space.

Feature(s)

  • Low Forward Voltage (VF) Minimizes Conduction Losses and Improves Efficiency
  • Reduced High Temperature Reverse Leakage; Increased Reliability Against Thermal Runaway Failure in High Temperature Operation

Application(s)

  • Mobile phone
  • Computers
  • Peripheral

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP) Standard
Maximum Peak Pulse Current IPP @ 8x20µs Max 4
AEC Qualified Yes
Configuration Single (Bi-Directional)
Channel Input CapacitanceCT Typ (pF) 6 pF
Reverse Standoff Voltage VRWM(V) 5.5 V
Breakdown VoltageVBR Min(V) 6 V
Typ Reverse Leakage Current IR @ VRWM Max(µA) 0.01 µA
Maximum Clamping Voltage @ Max Peak Pulse Current VC (V) 13 V
VESD IEC61000-4-2 Contact Discharge(kV) 15 kV

Related Content

Packages

Applications

Technical Documents

Recommended Soldering Techniques

TN1.pdf

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