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DFLS130

Schottky

Datasheet

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Feature(s)

Guard Ring Die Construction for Transient Protection
Low Power Loss, High Efficiency
High Surge Capability
High Current Capability and Low Forward Voltage Drop
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please refer to the related automotive grade (Q-suffix) part.
A listing can be found at https://www.diodes.com/products/automotive/automotiveproducts/.
This part is qualified to JEDEC standards (as references in
AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/

Specifications & Technical Documents

Product Parameters

AEC Qualified	Yes
Compliance (Only Automotive Supports PPAP)	Standard
Configuration	Single
MaximumAverageRectifiedCurrent I_O(A)	1 A
@ TerminalTemperature TT (ºC)	120 ºC
Peak RepetitiveReverse VoltageV_RRM(V)	30 V
Peak ForwardSurge CurrentI_FSM(A)	22 A
Forward VoltageDrop V_F(V)	0.42 V
@ I_F(A)	1 A
Maximum ReverseCurrent I_R(µA)	1000 µA
@ V_R(V)	30 V

Technical Documents

SPICE Model

DFLS130.spice.txt

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

RoHSFile

Purchase & Availablity

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2477	2020-08-17	2021-05-09	Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi
PCN-2459	2020-05-28	2020-11-28	Device End of Life (EOL)