Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.
PowerDI-123.pngSURFACE MOUNT ZENER DIODE
Contact Sales
Log in or register to manage email notifications about changes to datasheets or PCNs for this part.
| AEC Qualified | Yes |
|---|---|
| Compliance (Only Automotive supports PPAP) | Automotive |
| Configuration | Single |
| Power Rating(mW) | 1000 |
| Nom VZ (V) | 18 |
| @ IZT (mA) | 25 mA |
| Tol V (Typ) (%) | 5 % |
| IR (µA) | 1 µA |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2656 | 2023-12-20 | 2024-03-20 | Qualification of Additional Wafer Source Using Different Back Metal Composition and Thickness, and Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using Different Back Metal Composition and Thickness, PdCu Bond Wire, New Lead Frame, New Mold Compound Types for Select Automotive Products. |
| PCN-2462 | 2020-05-08 | 2021-04-11 | Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site (Automotive) |
| PCN-2391 | 2019-05-24 | 2019-08-24 | Clip Bond Structure, Lead Frame Type, and Mold Compound changes to enhance PowerDI-123 package |
