Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.

PowerDi5060-8-Type-C.png

Back to MOSFET Master Table

DMC1015UPD

COMPLEMENTARY PAIR ENHANCEMENT MODE MOSFET

Datasheet

Contact Sales

Description

This new generation complementary pair enhancement mode MOSFET has been designed to minimize R_DS(ON)yet maintain superior switching performance. This device is ideal for use in notebook battery power management and load switch.

Feature(s)

Thermally Efficient Package – Cooler Running Applications
High Conversion Efficiency
Low R_DS(ON)– Minimizes On-State Losses
Low Input Capacitance
Fast Switching Speed
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please refer to the related automotive grade (Q-suffix) part. A listing can be found at https://www.diodes.com/products/automotive/automotiveproducts/.
This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/

Application(s)

Notebook battery power management
DC-DC converters
Load switches

Product Specifications

Product Parameters

AEC Qualified	Yes
Compliance (Only Automotive(Q) supports PPAP)	Standard
Polarity	N+P
ESD Diodes (Y\|N)	No
\|V_DS\| (V)	12, 20 V
\|V_GS\| (±V)	8, 8 ±V
\|I_DS\| @T_A = +25°C (A)	9.5, 6.8
P_D @T_A = +25°C (W)	2.3
R_DS(ON)Max@ V_GS(4.5V)(mΩ)	17, 35 mΩ
R_DS(ON)Max@ V_GS(2.5V)(mΩ)	25, 55 mΩ
\|V_GS(TH)\| Min (V)	0.6, 0.6 V
\|V_GS(TH)\| Max (V)	1.5, 1.5 V
Q_G Typ @ \|V_GS\| = 4.5V (nC)	15.6, 15.4 nC
C_ISS Typ (pF)	1495, 1745 pF
C_ISS Condition @\|V_DS\| (V)	6, 10 V

Technical Documents

SPICE Model

DMC1015UPD.spice.txt

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2495	2021-03-31	2021-07-01	Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process Source for Select Discrete Products
PCN-2439	2019-12-05	2020-03-05	Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site, Using Gold Bond Wire, and as an Additional Wafer Back Grinding and Back Metal Process Source on Select MOSFET Products