Back to MOSFET Master Table

DMC6070LND

COMPLEMENTARY PAIR ENHANCEMENT MODE MOSFET

Datasheet

Contact Sales

Description

This new generation MOSFET has been designed to minimize the on-state resistance (R_DS(ON)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications.

Feature(s)

Low On-Resistance
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Complementary Pair MOSFET
Totally Lead-Free & Fully RoHS Compliant
Halogen and Antimony Free. “Green” Device

Application(s)

Power Management Functions
Analog Switch
Motor Control
Coffee Machines
Power Supplies

Product Specifications

Product Parameters

AEC Qualified	No
Compliance (Only Automotive(Q) supports PPAP)	Standard
Polarity	N+P
ESD Diodes (Y\|N)	No
\|V_DS\| (V)	60, 60 V
\|V_GS\| (±V)	20, 20 ±V
\|I_DS\| @T_A = +25°C (A)	3.1, 2.4
P_D @T_A = +25°C (W)	1.4
R_DS(ON)Max@ V_GS(10V)(mΩ)	85, 150 mΩ
R_DS(ON)Max@ V_GS(4.5V)(mΩ)	120, 250 mΩ
\|V_GS(TH)\| Max (V)	3, 3 V
Q_G Typ @ \|V_GS\| = 4.5V (nC)	5.2, 4.3 nC
Q_G Typ @ \|V_GS\| = 10V (nC)	11.5, 8.9 nC
C_ISS Typ (pF)	731, 612 pF
C_ISS Condition @\|V_DS\| (V)	20, 20 V

Technical Documents

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2425	2019-10-04	2020-01-04	Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and Additional Wafer Source for Select Products.