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SOT363.pngCOMPLEMENTARY PAIR ENHANCEMENT MODE MOSFET
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| AEC Qualified | Yes |
|---|---|
| Compliance (Only Automotive(Q) supports PPAP) | Standard |
| Polarity | N+P |
| ESD Diodes (Y|N) | Yes |
| |VDS| (V) | 20, 20 V |
| |VGS| (±V) | 6, 6 ±V |
| |IDS| @TA = +25°C (A) | 1.07, 0.85 |
| PD @TA = +25°C (W) | 0.33 |
| RDS(ON)Max@ VGS(4.5V)(mΩ) | 450, 750 mΩ |
| RDS(ON)Max@ VGS(2.5V)(mΩ) | 600, 1050 mΩ |
| RDS(ON)Max@ VGS(1.8V)(mΩ) | 750, 1500 mΩ |
| |VGS(TH)| Min (V) | 0.5, 0.5 V |
| |VGS(TH)| Max (V) | 1, 1 V |
| QG Typ @ |VGS| = 4.5V (nC) | 0.74, 0.62 nC |
| CISS Typ (pF) | 60.67, 59.76 pF |
| CISS Condition @|VDS| (V) | 10, 16 V |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2458 | 2020-07-01 | 2020-10-01 | Qualification of Assembly & Test Site Transfer, and Additional Assembly & Test Site for Select Discrete Products |
| PCN-2425 | 2019-10-04 | 2020-01-04 | Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and Additional Wafer Source for Select Products. |
