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SOT23.pngNRND = Not Recommended for New Design
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| Compliance (Only Automotive supports PPAP) | On Request |
|---|---|
| CISS Condition @|VDS| (V) | N/A |
| CISS Typ (pF) | 151 |
| ESD Diodes (Y|N) | Yes |
| |IDS| @TA = +25°C (A) | 6.5 |
| PD @TA = +25°C (W) | 1.3 |
| Polarity | N |
| QG Typ @ |VGS| = 10V (nC) | N/A |
| QG Typ @ |VGS| = 4.5V (nC) | 8.5 |
| AEC Qualified | Yes |
| RDS(ON)Max@ VGS(1.8V)(mΩ) | 36 |
| RDS(ON)Max@ VGS(10V)(mΩ) | N/A |
| RDS(ON)Max@ VGS(2.5V)(mΩ) | 29 |
| RDS(ON)Max@ VGS(4.5V)(mΩ) | 25 |
| |VDS| (V) | 20 |
| |VGS| (±V) | 12 |
| |VGS(TH)| Max (V) | 0.9 |
| |VGS(TH)| Min (V) | 0.5 |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2425 | 2019-10-04 | 2020-01-04 | Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and Additional Wafer Source for Select Products. |
