Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.
V-DFN3030-12-Type-B-Chip-Image.pngSingle Channel Smart Load Switch
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The DML3009LDC is a single channel load switch with very low onresistance in a small package. It contains an N-Channel MOSFET for up to 13.5V input voltage operation and 20A current channel. The load switch is controlled by a low voltage control signal through the ON Pin.
The DML3009LDC load switch provides a component and area-reducing solution for efficient power domain switching with inrush current limit via soft-start. In addition to integrated control functionality with ultra-low on-resistance, this device offers system safeguards and monitoring via fault protection and power good signaling. This cost-effective solution is ideal for power management and hot-swap applications requiring low-power consumption in a small footprint.
| Type | Load Switch |
|---|---|
| AEC Qualified | No |
| Compliance (Only Automotive supports PPAP) | Standard |
| Maximum Continuous Output Current (A) | 15 |
| (MAX) Maximum Current Limit Fixed (A) | Not Limited |
| Adjustable Current Limit | No |
| Channels | 1 |
| Enable Logic | Active High |
| Minimum Operating Voltage (V) | 0.5 |
| Maximum Operating Voltage (V) | 13.5 |
| Quiescent Current Typ (µA) | 310 |
| RDS(ON) (VIN = 5V) Typ (mΩ) | 4.8 |
| Reverse Current Block | No |
| Minimum Power Supply Voltage (V) | 3 |
| Maximum Power Supply Voltage (V) | 5.5 |
| Output Discharge | Adjustable |
| (TYP) Output Rise Time mS | Adjustable |
| OCP Output Latch Off | No |
| OCP/SCP | SCP |
| OCP Flag | No |
| Power Good | open drain |
| Operating Ambient Temperature Range (°C) | -40 to 85 |
| Overtemperature Protection | Yes |
| UL Certificate | No |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2495 | 2021-03-31 | 2021-07-01 | Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process Source for Select Discrete Products |
