30V SYNCHRONOUS N-CHANNEL ENHANCEMENT MODE MOSFET
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| AEC Qualified | No |
|---|---|
| Compliance (Only Automotive(Q) supports PPAP) | Standard |
| Polarity | N+N |
| ESD Diodes (Y|N) | Yes |
| |VDS| (V) | 30 V |
| |VGS| (±V) | 10, 10 ±V |
| |IDS| @TA = +25°C (A) | 9.5, 9.5 |
| |IDS| @TC = +25°C (A) | 15 |
| PD @TA = +25°C (W) | 2.16 |
| RDS(ON)Max@ VGS(10V)(mΩ) | 14.3, 14.3 (@8V) mΩ |
| RDS(ON)Max@ VGS(4.5V)(mΩ) | 16.1, 16.1 mΩ |
| |VGS(TH)| Max (V) | 1.2, 1.2 V |
| QG Typ @ |VGS| = 4.5V (nC) | 3.3, 3.4 nC |
| CISS Typ (pF) | 387 pF |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2628 | 2023-05-11 | 2023-08-11 | Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source for Select Discrete Products |
| PCN-2495 | 2021-03-31 | 2021-07-01 | Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process Source for Select Discrete Products |
| PCN-2425 | 2019-10-04 | 2020-01-04 | Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and Additional Wafer Source for Select Products. |
