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TO252-DPAK.pngN-CHANNEL ENHANCEMENT MODE MOSFET
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This new generation MOSFET has been designed to minimize the onstate resistance (RDS(ON)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications.
| AEC Qualified | Yes |
|---|---|
| Compliance (Only Automotive(Q) supports PPAP) | Standard |
| Polarity | N |
| ESD Diodes (Y|N) | No |
| |VDS| (V) | 40 V |
| |VGS| (±V) | 20 ±V |
| |IDS| @TA = +25°C (A) | 11.9 |
| |IDS| @TC = +25°C (A) | 39 |
| PD @TA = +25°C (W) | 2.4 |
| RDS(ON)Max@ VGS(10V)(mΩ) | 11.5 mΩ |
| RDS(ON)Max@ VGS(4.5V)(mΩ) | 14.5 mΩ |
| |VGS(TH)| Min (V) | 1 V |
| |VGS(TH)| Max (V) | 3 V |
| QG Typ @ |VGS| = 4.5V (nC) | 17 nC |
| QG Typ @ |VGS| = 10V (nC) | 37 nC |
| CISS Typ (pF) | 1810 pF |
| CISS Condition @|VDS| (V) | 20 V |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2475 | 2020-08-06 | 2020-11-06 | Qualification of Assembly & Test Site Transfer for Select Discrete Products |
| PCN-2425 | 2019-10-04 | 2020-01-04 | Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and Additional Wafer Source for Select Products. |
| PCN-2403 | 2019-03-25 | 2019-06-19 | Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, Additional Wafer Source, or Additional Assembly and Test site for Select Products. |
