20V P-CHANNEL ENHANCEMENT MODE MOSFET
Contact Sales
Log in or register to manage email notifications about changes to datasheets or PCNs for this part.
| AEC Qualified | Yes |
|---|---|
| Compliance (Only Automotive(Q) supports PPAP) | Standard |
| Polarity | P |
| ESD Diodes (Y|N) | No |
| |VDS| (V) | 20 V |
| |VGS| (±V) | 12 ±V |
| |IDS| @TC = +25°C (A) | 60 |
| PD @TA = +25°C (W) | 2.3 |
| RDS(ON)Max@ VGS(10V)(mΩ) | 1.9 mΩ |
| RDS(ON)Max@ VGS(4.5V)(mΩ) | 2.4 mΩ |
| RDS(ON)Max@ VGS(2.5V)(mΩ) | 3.8 mΩ |
| |VGS(TH)| Min (V) | 0.5 V |
| |VGS(TH)| Max (V) | 1.4 V |
| QG Typ @ |VGS| = 4.5V (nC) | 228 nC |
| QG Typ @ |VGS| = 10V (nC) | 476 nC |
| CISS Typ (pF) | 12826 pF |
| CISS Condition @|VDS| (V) | 10 V |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2628 | 2023-05-11 | 2023-08-11 | Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source for Select Discrete Products |
| PCN-2425 | 2019-10-04 | 2020-01-04 | Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and Additional Wafer Source for Select Products. |
__PadWzUwMCw0MDAsIkZGRkZGRiIsMF0.jpg)
.jpg){kind=link}