Diodes Incorporated — Analog and discrete power solutions
PowerDI3333 8

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DMT10H015LFG

100V N-CHANNEL ENHANCEMENT MODE MOSFET

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Description

This MOSFET is designed to minimize the on-state resistance (RDS(ON)) yet maintain superior switching performance, making it ideal for high-efficiency power-management applications.

Feature(s)

  • Low RDS(ON) – Ensures On-State Losses Are Minimized
  • Excellent Qgd x RDS (ON) Product (FOM)
  • Advanced Technology for DC/DC Converters
  • Small Form Factor Thermally Efficient Package Enables Higher Density End Products
  • Occupies Just 33% of The Board Area Occupied by SO-8 Enabling Smaller End Product
  • 100% UIS (Avalanche) Rated
  • Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please refer to the related automotive grade (Q-suffix) part. A listing can be found at https://www.diodes.com/products/automotive/automotiveproducts/.
  • This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/

Application(s)

  • Synchronous rectifiers
  • Backlighting
  • Power-management functions
  • DC-DC converters

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive(Q) supports PPAP) Standard
Polarity N
ESD Diodes (Y|N) No
|VDS| (V) 100 V
|VGS| (±V) 20 ±V
|IDS| @TA = +25°C (A) 10
|IDS| @TC = +25°C (A) 42
PD @TA = +25°C (W) 2
RDS(ON)Max@ VGS(10V)(mΩ) 13.5 mΩ
RDS(ON)Max@ VGS(4.5V)(mΩ) 23.5 mΩ
|VGS(TH)| Max (V) 3.5 V
QG Typ @ |VGS| = 10V (nC) 33.3 nC
CISS Typ (pF) 1871 pF
CISS Condition @|VDS| (V) 50 V

Related Content

Packages

Applications

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2628 2023-05-11 2023-08-11 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source for Select Discrete Products
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products
PCN-2403 2019-03-25 2019-06-19 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, Additional Wafer Source, or Additional Assembly and Test site for Select Products.