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DMT10H072LFV

100V N-CHANNEL ENHANCEMENT MODE MOSFET

Datasheet

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Description

This new generation MOSFET is designed to minimize the on-state resistance (RDS(ON)) and yet maintain superior switching performance, making it ideal for high-efficiency power management applications.

Feature(s)

Low RDS(ON) – Ensures On-State Losses are Minimized
Small Form Factor Thermally Efficient Package Enables Higher Density End Products
Occupies just 33% of the Board Area Occupied by SO-8 Enabling Smaller End Product
Low On-Resistance

Application(s)

Power Management Functions
Battery Operated Systems and Solid-State Relays
Drivers: Relays, Solenoids, Lamps, Hammers, Displays, Memories, Transistors, etc.

Product Specifications

Product Parameters

AEC Qualified	No
Compliance (Only Automotive(Q) supports PPAP)	Standard
Polarity	N
ESD Diodes (Y\|N)	No
\|V_DS\| (V)	100 V
\|V_GS\| (±V)	20 ±V
\|I_DS\| @T_A = +25°C (A)	4.7
\|I_DS\| @T_C = +25°C (A)	20
P_D @T_A = +25°C (W)	2
P_D @T_C = +25°C (W)	37.8
R_DS(ON)Max@ V_GS(10V)(mΩ)	62 mΩ
R_DS(ON)Max@ V_GS(4.5V)(mΩ)	109 mΩ
\|V_GS(TH)\| Max (V)	2.8 V
Q_G Typ @ \|V_GS\| = 4.5V (nC)	2.5 nC
Q_G Typ @ \|V_GS\| = 10V (nC)	4.5 nC
C_ISS Typ (pF)	228 pF
C_ISS Condition @\|V_DS\| (V)	50 V

Technical Documents

SPICE Model

DMT10H072LFV.spice.txt

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2425	2019-10-04	2020-01-04	Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and Additional Wafer Source for Select Products.