Diodes Incorporated — Analog and discrete power solutions
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DMT31M6LPS

30V N-CHANNEL ENHANCEMENT MODE MOSFET

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Description

This MOSFET is designed to minimize the on-state resistance (RDS(ON)) and yet maintain superior switching performance, making it ideal for high efficiency power management applications.

Feature(s)

  • Low RDS(ON) – Minimizes On-State Losses
  • Excellent QGD x RDS(ON) Product (FOM)
  • Advanced Technology for DC-DC Converters
  • Small Form Factor Thermally Efficient Package Enables Higher Density End Products
  • 100% Unclamped Inductive Switching – Ensures More Reliability

Application(s)

  • Backlighting
  • Power Management Functions
  • DC-DC Converters

Product Specifications

Product Parameters

AEC Qualified No
Compliance (Only Automotive(Q) supports PPAP) Standard
Polarity N
ESD Diodes (Y|N) No
|VDS| (V) 30 V
|VGS| (±V) 20 ±V
|IDS| @TA = +25°C (A) 35.8
|IDS| @TC = +25°C (A) 150
PD @TA = +25°C (W) 2.5
PD @TC = +25°C (W) 100
RDS(ON)Max@ VGS(10V)(mΩ) 1.35 mΩ
RDS(ON)Max@ VGS(4.5V)(mΩ) 2.4 mΩ
|VGS(TH)| Min (V) 1 V
|VGS(TH)| Max (V) 3 V
QG Typ @ |VGS| = 4.5V (nC) 59.1 nC
QG Typ @ |VGS| = 10V (nC) 123 nC
CISS Typ (pF) 7019 pF
CISS Condition @|VDS| (V) 15 V

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2628 2023-05-11 2023-08-11 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source for Select Discrete Products
PCN-2425 2019-10-04 2020-01-04 Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and
Additional Wafer Source for Select Products.