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DMTH6010SK3

N-CHANNEL ENHANCEMENT MODE MOSFET

Datasheet

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Description

This new generation N-Channel Enhancement Mode MOSFET is designed to minimize R_DS(ON) and yet maintain superior switching performance. This device is ideal for use in Notebook battery power management and Loadswitch.

Feature(s)

Low R_DS(ON) – ensures on state losses are minimized
Excellent Q_gd x _{RDS (ON)} Product (FOM)
Advanced Technology for DC/DC converts
Small form factor thermally efficient package enables higher density end products

Application(s)

Power Mangagement Functions
DC-DC Converters
Backlighting

Product Specifications

Product Parameters

AEC Qualified	Yes
Compliance (Only Automotive(Q) supports PPAP)	Standard
Polarity	N
ESD Diodes (Y\|N)	No
\|V_DS\| (V)	60 V
\|V_GS\| (±V)	20 ±V
\|I_DS\| @T_A = +25°C (A)	16.3
\|I_DS\| @T_C = +25°C (A)	70
P_D @T_A = +25°C (W)	3.1
P_D @T_C = +25°C (W)	59
R_DS(ON)Max@ V_GS(10V)(mΩ)	8 mΩ
\|V_GS(TH)\| Max (V)	4 V
Q_G Typ @ \|V_GS\| = 10V (nC)	38.1 nC
C_ISS Typ (pF)	2841 pF
C_ISS Condition @\|V_DS\| (V)	30 V

Technical Documents

SPICE Model

DMTH6010SK3 .spice.txt

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2425	2019-10-04	2020-01-04	Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and Additional Wafer Source for Select Products.
PCN-2403	2019-03-25	2019-06-19	Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, Additional Wafer Source, or Additional Assembly and Test site for Select Products.