Diodes Incorporated — Analog and discrete power solutions
SOT363

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SOT363.png
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DRDNB21D

multi-chip

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Feature(s)

  • Epitaxial Planar Die Construction
  • Two Pre-Biased Transistors and Two Switching Diodes, Internally Connected in One Package
  • Ideally Suited for Automated Assembly Processes
  • Lead Free By Design/RoHS Compliant
  • "Green" Device
  • Qualified to AEC-Q101 standards for High Reliability
  • Product Specifications

    Product Parameters

    AEC Qualified No
    Compliance (Only Automotive supports PPAP) Standard
    R1 / R2 (KΩ) No KΩ
    MaximumVCEO/VCC (V) 50 V
    MaximumIO/IC (mA) 200 mA

    Related Content

    Packages

    Technical Documents

    SPICE Model

    Recommended Soldering Techniques

    TN1.pdf

    RoHS CofC

    Product Change Notices (PCNs)

    A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

    PCN # Issue Date Implementation Date Subject
    PCN-2461 2020-05-08 2021-04-05 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site
    PCN-2315 2018-03-09 2018-06-09 Qualification of Alternative Wafer Sources for Select Products Due to Closure of Diodes FabTech (KFAB) Facility