Diodes Incorporated — Analog and discrete power solutions
SOT26

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SOT26-Chip-Image.png

DVRN6056

Multi-Chip, Voltage Reference Array

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Feature(s)

  • Epitaxial Planar Die Construction
  • Ideally Suited for Automated Assembly Processes
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)

Product Specifications

Product Parameters

AEC Qualified No
Compliance (Only Automotive supports PPAP) Standard
hFE (Min) @ IC=100mA, VCE=1V <99
IR (Max) (μA) @ VR=2.5V 1
IR (Max) (μA) @ VR=3V N/A
V(BR)CBO (Min) (V) @ IC=100μA, IE=0μA 60
V(BR)CEO (Min) (V) @ IC=1mA, IB=0µA 40
V(BR)EBO (Min) (V) @ IE=100μA, IC=0μA 6
VZ (Nom) (V) @ IZT=0.05mA N/A
VZ (Nom) (V) @ IZT=5mA 5.6

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2461 2020-05-08 2021-04-05 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site
PCN-2315 2018-03-09 2018-06-09 Qualification of Alternative Wafer Sources for Select Products Due to Closure of Diodes FabTech (KFAB) Facility