NRND = Not Recommended for New Design
PNP, 100V, 3A, TO252
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Compliance (Only Automotive supports PPAP) | Automotive |
---|---|
Category | Medium Power Transistor |
Compliance(Only Automotive supports PPAP) | Automotive |
fT (MHz) | N/A |
fT (MHz) | 3 |
hFE (min) | 25 |
hFE(@ IC) | 1 |
hFE (@ IC) (A) | 1 |
hFE(@ IC2) | 3 |
hFE (@ IC2) (A) | 3 |
hFE(Min 2) | 10 |
hFE (Min) | 25 |
IC (A) | 3 |
IC (A) | 3 |
ICM (A) | 5 |
ICM (A) | 5 |
PD (W) | 2.1 |
PD (W) | 2.1 |
Polarity | PNP |
Product Type | PNP |
AEC Qualified | Yes |
RCE(SAT) | N/A |
RCE(sat) (mΩ) | - |
VCE (SAT) (@ IC/IB) (A/m A) | N/A |
VCE (SAT)(Max.2) | N/A |
VCE (SAT)Max (mV) | 1200 |
VCE(SAT) (@ IC/IB) (A/mA) | 3, 375 |
VCE(sat) (@ IC/IB2) (A/mA) | - |
VCE(sat) (Max.2) (mV) | - |
VCE(sat) Max (mV) | 1200 |
VCEO, VCES (V) | 100 |
VCEO, VCES (V) | 100 |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
PCN # | Issue Date | Implementation Date | Subject |
---|---|---|---|
PCN-2644 | 2023-09-27 | 2023-12-27 | Lead Frame Type, Die Bond Process, Wire Bond Type and Mold Compound changes to enhance select TO-252 packaged automotive products |