Diodes Incorporated — Analog and discrete power solutions
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MMBZ5245BWQ

200mW SURFACE MOUNT ZENER DIODE

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Feature(s)

  • Small Surface Mount Package
  • Ideally Suited for Automated Assembly Processes

Application(s)

  • Advanced Driver Assistance Systems
  • Body Control Module
  • Infotainment and Telematics
  • Interior and Exterior Lighting
  • Power Train
  • Seat Control Module

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive supports PPAP) Automotive
Configuration Single
Power Rating(mW) 200
Nom VZ (V) 15
@ IZT (mA) 8.5 mA
Tol V (Typ) (%) 5 %
IR (µA) 0.1 µA

Related Content

Packages

Technical Documents

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2656 2023-12-20 2024-03-20 Qualification of Additional Wafer Source Using Different Back Metal Composition and Thickness, and Qualification of Internal "Diodes Technology (Cheng Du) Company Limited" (CAT) as Additional Assembly & Test Site Using Different Back Metal Composition and Thickness, PdCu Bond Wire, New Lead Frame, New Mold Compound Types for Select Automotive Products.
PCN-2545 2021-10-05 2022-01-05 Phenitec Wafer Manufacturing Site Change and Additional Wafer Source on Select Automotive Products
PCN-2462 2020-05-08 2021-04-11 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site (Automotive)