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PI6C49CB04BQ

Automotive 1 to 4 LVCMOS/LVTTL Fanout Buffer, no OE

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Description

The PI6C49CB04BQ is a low-skew, 1-to-4 fanout buffer. Guaranteed output and part-to-part skew characteristics make the PI6C49CB04BQ ideal for clock distribution applications that demand well-defined performance and repeatability.

Feature(s)

  • Four LVCMOS / LVTTL Outputs
  • LVCMOS / LVTTL Clock Input
  • CLK Accepts LVCMOS, LVTTL Input Levels
  • Maximum Output Frequency: 250MHz
  • Additive Phase Jitter, RMS: 0.173ps (Typical) @ 3.3V
  • Output Skew: 45ps (Maximum) @ 3.3V
  • Part-to-Part Skew: 500ps (Maximum)
  • Small 8 Lead SOIC Package Saves Board Space
  • Full 3.3V, 2.5V, 1.8V Operation Mode or 3.3V/2.5V/1.8V Core with 2.5V, 1.8V, 1.5V Supply Modes
  • AEC-Q100 Qualified
  • Automotive Grade 2 Temperature Range (-40°C to 105°C)
  • Automotive Grade 3 Temperature Range (-40°C to 85°C)
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • The PI6C49CB04BQ is suitable for automotive applications requiring specific change control and is AEC-Q100 qualified, PPAP capable, and manufactured in IATF 16949 certified facilities.
  • https://www.diodes.com/quality/product-definitions/
  • Packaging (Pb-free & Green): 8-pin, SOIC (W)

Product Specifications

Product Parameters

Compliance(Only Automotive supports PPAP) Automotive
Function Buffer
Number of Outputs 4
Output Type(s) LVCMOS/LVTTL
Maximum Output Frequency (MHz) 200
Additive Jitter (ps) 0.05
Supply Voltage (V) 1.5V-3.3V
Input Type(s) LVCMOS/LVTTL
Skew (ps) 250
Ambient or Junction Temperature (°C) -40 to 105 °C

Related Content

Packages

Applications

Technical Documents

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2586 2022-06-08 2022-09-08 Qualified Additional Wafer Fab Backend IMD Material and Process - Automotive