Diodes Incorporated — Analog and discrete power solutions
D FLat A

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D-FLat-A.png
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RS1MDF

1.0A SURFACE MOUNT FAST RECOVERY RECTIFIER

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Description

The RS1MDF is a rectifier packaged in the low profile D-FLAT package. Providing fast recovery time for high efficiency, this device is ideal for use in general rectification applications.

Feature(s)

  • Glass Passivated Die Construction
  • Fast Recovery Time for High Efficiency
  • Surge Overload Rating to 30A Peak
  • High Current Capability
  • Low Profile Design, Package Height Less than 1.1mm
  • Lead-Free Finish; RoHS Compliant
  • Halogen and Antimony Free. “Green” Device
  • Qualified to AEC-Q101 Standards for High Reliability

Application(s)

  • Switching Mode Power Supplies
  • DC-DC Converters

Product Specifications

Product Parameters

Compliance (Only Automotive supports PPAP) Standard
AEC Qualified Yes
Product Type FAST RECOVERY RECTIFIER
Configuration Single
MaximumAverageRectifiedCurrent IO (A) 1 A
Maximum Peak Forward Surge Current IFSM (A) 30 A
Peak RepetitiveReverse VoltageVRRM (V) 1000 V
Forward VoltageDrop VF(V) 1.3 V
@ IF (A) 1 A
Maximum ReverseCurrent IR (µA) 5 µA
@ VR (V) 1000 V
Reverse RecoveryTime trr (ns) 500 ns
TotalCapacitance CT (pF) 5 pF

Technical Documents

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2701 2024-11-18 2025-02-17 Transfer of Wafer Manufacturing Site and Additional Wafer Source for Select Discrete Products
PCN-2613 2023-04-12 2023-07-12 Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Discrete Products
PCN-2398 2019-05-21 2019-08-21 Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Products
PCN-2337 2018-06-04 2018-05-04 Qualification of Additional Wafer Sources and Additional Assembly and Test Sites for Select Products