Diodes Incorporated — Analog and discrete power solutions
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S8NC

standard rectifier

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Description

The S8NC is 8.0A Surface Mount Glass Passivated Rectifier in SMC package, offers high current capability and low forward voltage drop, designed with guard ring for transient protection and high surge capacity.

Feature(s)

  •  Glass Passivated Die Construction
  •  Low Forward Voltage Drop and High Current Capability
  •  Surge Overload Rating to 225A Peak
  •  High Reverse Breakdown Voltage of 1200V
  •  Lead-Free Finish/RoHS Compliant 
  •  Halogen and Antimony Free. “Green” Device 

Application(s)

  • Switching Mode Power Supplies
  • DC-DC Converter

Product Specifications

Product Parameters

TotalCapacitance CT (pF) 40
AEC Qualified No
Compliance (Only Automotive supports PPAP) Standard
Product Type 8A SURFACE MOUNT GLASS PASSIVATED RECTIFIER
Configuration Single
MaximumAverageRectifiedCurrent IO (A) 8 A
Peak ForwardSurge CurrentIFSM(A) 225 A
Peak RepetitiveReverse VoltageVRRM (V) 1200 V
Forward VoltageDrop VF(V) 1.1 V
@ IF (A) 8 A
Maximum ReverseCurrent IR (µA) 10 µA
@ VR (V) 1200 V
Reverse RecoveryTime trr (ns) N/A ns

Related Content

Packages

Technical Documents

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2701 2024-11-18 2025-02-17 Transfer of Wafer Manufacturing Site and Additional Wafer Source for Select Discrete Products
PCN-2588 2022-06-01 2022-09-01 Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound, and Qualification of Additional
Diodes Internal Assembly & Test Site (SSEC) for Select Discrete Products
PCN-2398 2019-05-21 2019-08-21 Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Products
PCN-2337 2018-06-04 2018-05-04 Qualification of Additional Wafer Sources and Additional Assembly and Test Sites for Select Products