Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SMAF
Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SMAF
Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SMAF
SBR
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| @ TerminalTemperature TT (ºC) | - |
|---|---|
| AEC Qualified | Yes |
| Compliance (Only Automotive Supports PPAP) | Standard |
| Configuration | Single |
| Maximum Average Rectified Current IO (A) | 3 |
| Peak Repetitive Reverse Voltage VRRM (V) | 40 |
| Peak Forward Surge Current IFSM (A) | 50 |
| Forward VoltageDrop VF(V) | 0.53 |
| @ IF (A) | 3 |
| Maximum Reverse Current IR (μA) | 400 |
| @ VR (V) | 40 |
| Reverse Recovery Time trr (ns) | - |
| Total Capacitance CT (pF) | - |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2660 | 2024-03-13 | 2024-06-13 | Qualification of Additional Wafer Source with Wafer Diameter and Mold Compound Changes for Select Discrete Products |
| PCN-2613 | 2023-04-12 | 2023-07-12 | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Discrete Products |
