Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.
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| @ TerminalTemperature TT (ºC) | N/A |
|---|---|
| AEC Qualified | Yes |
| Compliance (Only Automotive supports PPAP) | Automotive |
| Configuration | Single |
| Maximum Average Rectified Current IO (A) | 3 |
| Peak Repetitive Reverse Voltage VRRM (V) | 40 |
| Peak Forward Surge Current IFSM (A) | 45 |
| Forward VoltageDrop VF(V) | 0.5 |
| @ IF (A) | 3 |
| Maximum Reverse Current IR (μA) | 400 |
| @ VR (V) | 40 |
| Reverse Recovery Time trr (ns) | N/A |
| Total Capacitance CT (pF) | N/A |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2661 | 2024-02-21 | 2024-05-21 | Qualification of Additional Wafer Source and Wafer Diameter Change |
| PCN-2590 | 2022-06-01 | 2022-09-01 | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products |
| PCN-2404 | 2019-05-21 | 2019-08-21 | Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Automotive Products |
