Diodes Incorporated — Analog and discrete power solutions
TO252 DPAK

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TO252-DPAK.png
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SBR6100CTLQ

SBR

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Description

The SBR6100CTLQ is dual center tap rectifier in TO252 (DPAK) package. Offering excellent high-temperature stability and superior avalanche capability, this device is specifically intended for use in automotive applications.

Feature(s)

  • Low-Forward Voltage Drop (VF); Better Efficiency and Cooler Operation
  • Reduced High-Temperature Reverse Leakage; Increased Reliability Against Thermal Runaway Failure in High-Temperature Operation
  • Excellent High-Temperature Stability
  • Patented Super Barrier Rectifier (SBR®) Technology
  • Soft, Fast Switching Capability
  • +150°C Operating Junction Temperature
  • Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • The SBR6100CTLQ is suitable for automotive applications requiring specific change control; this part is AEC-Q101 qualified, PPAP capable, and manufactured in IATF16949 certified facilities. https://www.diodes.com/quality/product-definitions/

Application(s)

  • DC/DC converters
  • DC/AC inverters
  • AC/DC power supplies

Product Specifications

Product Parameters

@ TerminalTemperature TT (ºC) 150
AEC Qualified Yes
Compliance (Only Automotive supports PPAP) Automotive
Configuration Dual
Maximum Average Rectified Current IO (A) 6
Peak Repetitive Reverse Voltage VRRM (V) 100
Peak Forward Surge Current IFSM (A) 78
Forward VoltageDrop VF(V) 0.74
@ IF (A) 3
Maximum Reverse Current IR (μA) 100
@ VR (V) 100
Reverse Recovery Time trr (ns) N/A
Total Capacitance CT (pF) 80

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2618 2023-03-03 2023-06-03 Qualification of Additional Wafer Source, Lead Frame Structure, and Mold Compound Type Changes for Select Discrete Automotive Products