Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.
PowerDI-5.pngNRND = Not Recommended for New Design
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| @ IF (A) | 10 |
|---|---|
| @ TerminalTemperature TT (ºC) | - |
| @ VR (V) | 50 |
| Compliance (Only Automotive supports PPAP) | No |
| Configuration | Single |
| Forward VoltageDrop VF(V) | 0.47 |
| MaximumAverageRectifiedCurrent IO (A) | 10 |
| Maximum ReverseCurrent IR (µA) | 150 |
| Peak ForwardSurge CurrentIFSM(A) | 300 |
| Peak RepetitiveReverse VoltageVRRM (V) | 50 |
| AEC Qualified | No |
| Reverse RecoveryTime trr (ns) | - |
| TotalCapacitance CT (pF) | - |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2517 | 2021-05-24 | 2020-11-24 | Device End of Life (EOL) |
| PCN-2418 | 2019-11-07 | 2020-05-07 | Device End of Life (EOL) |
| PCN-2425 | 2019-10-04 | 2020-01-04 | Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and Additional Wafer Source for Select Products. |
| PCN-2379 | 2018-11-29 | 2019-02-28 | Additional qualified suppliers for solderable front metal and back grind/back metal |
