Diodes Incorporated
PowerDI5060 8

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SBRT20U100SLP

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Description

Packaged in the compact thermally efficient PowerDI® 5060-8 package, the SBRT20U100SLP provides very low VF and excellent reverse leakage stability at high temperatures. It is ideal for use as a rectifier, freewheel diode or blocking diode in DC-DC converters and AC-DC adaptors.

Feature(s)

  • Reduced Ultra-Low Forward Voltage Drop (VF) – Better Efficiency and Cooler Operation
  • Reduced High Temperature Reverse Leakage – Increased Reliability Against Thermal Runaway Failure in High Temperature Operation
  • Less than 1.1mm Package Profile – Ideal for Thin Applications
  • Patented Super Barrier Rectifier Technology (SBR®)
  • Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please refer to the related automotive grade (Q-suffix) part. A listing can be found at https://www.diodes.com/products/automotive/automotiveproducts/.
  • This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/

Application(s)

  • DC-DC converters
  • AC-DC adaptors

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive supports PPAP) Standard
Configuration Single
MaximumAverageRectifiedCurrent IO (A) 20 A
Peak RepetitiveReverse VoltageVRRM (V) 100 V
Peak ForwardSurge CurrentIFSM(A) 180 A
Forward VoltageDrop VF(V) 0.7
@ IF (A) 20 A
Maximum ReverseCurrent IR (µA) 300 µA
@ VR (V) 100 V

Related Content

Packages

Technical Documents

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products