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SBRT3U40P1

Datasheet

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Description

Packaged in the compact thermally efficient PowerDI®123, the SBRT3U40P1 provides very low V_F and excellent reverse leakage stability at high temperatures. It is ideally suited to use as a rectifier diode in MR16 bridge rectifier applications.

Feature(s)

Reduced ultra-low forward voltage drop (V_F); better efficiency and cooler operation.
Reduced high-temperature reverse leakage; Increased reliability against thermal runaway failure in high-temperature operation.
<1.1mm package profile – ideal for thin applications.
Patented Super Barrier Rectifier SBR® Technology
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
The SBRT3U40P1Q is suitable for automotive applications requiring specific change control; this part is AEC-Q101 qualified, PPAP capable, and manufactured in IATF 16949 certified facilities. https://www.diodes.com/quality/product-definitions/

Application(s)

Bridge diodes
Blocking diodes
Reverse protection diodes

Product Specifications

Product Parameters

AEC Qualified	Yes
Compliance (Only Automotive supports PPAP)	Standard
Configuration	Single
MaximumAverageRectifiedCurrent I_O(A)	3 A
Peak RepetitiveReverse VoltageV_RRM(V)	40 V
Peak ForwardSurge CurrentI_FSM(A)	75 A
Forward VoltageDrop V_F(V)	0.49
@ I_F(A)	3 A
Maximum ReverseCurrent I_R(µA)	180 µA
@ V_R(V)	40 V
Reverse RecoveryTime trr (ns)	14 ns
TotalCapacitance C_T(pF)	150 pF

Technical Documents

SPICE Model

SBRT3U40P1.spice.txt

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2425	2019-10-04	2020-01-04	Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and Additional Wafer Source for Select Products.
PCN-2379	2018-11-29	2019-02-28	Additional qualified suppliers for solderable front metal and back grind/back metal