Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.
X3-DFN0603-2-3D.pngULTRA-SMALL SURFACE MOUNT SCHOTTKY DIODE
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The SDM02M30LP3 is a Schottky barrier diode optimized for low forward voltage drop and very low reverse leakage current. Encapsulated in the ultra-small DFN-0603 with footprint of 0.18mm2 and ultra-low package profile, this device is designed for saving PCB space in portable electronic devices.
| AEC Qualified | No |
|---|---|
| Compliance (Only Automotive supports PPAP) | Standard |
| Configuration | Single |
| Power Rating(mW) | 250 mW |
| Peak RepetitiveReverse VoltageVRRM (V) | 30 V |
| Forward Continuous Current IFM (mA) | 100 mA |
| Forward VoltageDrop VF(V) | 0.45 |
| @ IF(mA) | 10 mA |
| Maximum ReverseCurrent IR (µA) | 0.4 µA |
| @ VR (V) | 30 V |
| Capacitance CTOT Typ (pF) | N/A pF |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2623 | 2023-05-15 | 2023-11-15 | Device End of Life (EOL) |
| PCN-2477 | 2020-08-17 | 2021-05-09 | Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi |
| PCN-2461 | 2020-05-08 | 2021-04-05 | Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site |
| PCN-2299 | 2018-03-01 | 2018-06-01 | Additional Qualified (A/T) Assembly Test Site |
