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SDM02U30CSP

0.2 A SCHOTTKY BARRIER RECTIFER CHIP SCALE PACKAGE

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Description

The SDM02U30CSP is a 30 Volt 0.2A Schottky Barrier diode that is optimized for low forward voltage drop and low leakage current, housed in a compact chip scale package (CSP) that occupies only 0.18mm2 board space. The low thermal resistance enables designers to meet design challenges of increasing efficiency while at the same time reducing board space.

Feature(s)

  • 0.18mm2 Footprint, Off Board Profile of 0.28mm
  • Low Forward Voltage of 0.50V (Max) – Minimizes Power Dissipation Losses
  • Low Leakage – Maximizes Battery Power

Application(s)

  • Blocking Diode
  • Boost Diode
  • Reverse Protection Diode
  • Smartphones
  • Notebooks
  • Adapters
  • Monitors

Product Specifications

Product Parameters

AEC Qualified No
Compliance (Only Automotive supports PPAP) Standard
Configuration Single
Peak RepetitiveReverse VoltageVRRM (V) 30 V
Forward Continuous Current IFM (mA) 200 mA
Forward VoltageDrop VF(V) 0.5
@ IF(mA) 200 mA
Maximum ReverseCurrent IR (µA) 9 µA
@ VR (V) 30 V
Capacitance CTOT Typ (pF) N/A pF

Related Content

Packages

Applications

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2560 2021-12-16 2021-12-16 Additional Wafer Source (GFAB) and Additional Assembly and Test Site (SAT)