SDM10K45

Schottky

Datasheet

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Feature(s)

Fast Switching Speed
Ultra-Small Surface-Mount Package
For General Purpose Switching Applications
High Conductance
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please refer to the related automotive grade (Q-suffix) part. A listing can be found at https://www.diodes.com/products/automotive/automotiveproducts/ .
This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/

Product Specifications

Product Parameters

AEC Qualified	Yes
Compliance (Only Automotive supports PPAP)	Standard
Configuration	Single
Power Rating(mW)	200 mW
Peak RepetitiveReverse VoltageV_RRM(V)	45 V
Forward Continuous Current I_FM(mA)	100 mA
Forward VoltageDrop V_F(V)	0.45
@ I_F(mA)	10 mA
Maximum ReverseCurrent I_R(µA)	1 µA
@ V_R(V)	10 V
Capacitance C_TOT Typ (pF)	N/A pF

Technical Documents

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

RoHSFile

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2690	2024-05-29	2024-08-29	Qualification of Diodes’ subcontractor Eris Technology Corporation (Eris) in Taoyuan, Taiwan as Additional Assembly & Test Site and Diodes internal JKFAB in HsinChu, Taiwan as additional wafer source for Select Discrete Products.
PCN-2562	2022-01-04	2022-04-04	Qualification of Additional Wafer Back Grinding and Back Metal Process Source (GFAB) for Select Discrete Products
PCN-2477	2020-08-17	2021-05-09	Additional Wafer Source (GFAB), and Transfer Assembly and Test Site to DiYi
PCN-2459	2020-05-28	2020-11-28	Device End of Life (EOL)
PCN-2461	2020-05-08	2021-04-05	Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site
PCN-2418	2019-11-07	2020-05-07	Device End of Life (EOL)
PCN-2339	2018-06-15	2018-09-15	Qualification of Additional Wafer Source for Select Products