1A SCHOTTKY BARRIER RECTIFER CHIP SCALE PACKAGE
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The SDM1A30CSP is a 30V 1A Schottky barrier rectifier that is optimized for low forward voltage drop and low-leakage current, housed in a compact chip scale package (CSP) that occupies only 0.6mm2 board space. The low thermal resistance enables designers to meet design challenges of increasing efficiency while also reducing board space.
| @ IF (A) | 1 |
|---|---|
| @ TerminalTemperature TT (ºC) | N/A |
| @ VR (V) | 30 |
| Compliance (Only Automotive supports PPAP) | Standard |
| Configuration | Single |
| Forward VoltageDrop VF(V) | 0.525 |
| MaximumAverageRectifiedCurrent IO (A) | 1 |
| Maximum ReverseCurrent IR (µA) | 100 |
| Peak ForwardSurge CurrentIFSM(A) | 15 |
| Peak RepetitiveReverse VoltageVRRM (V) | 30 |
| AEC Qualified | No |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2600 | 2022-10-03 | 2023-04-03 | Device End of Life (EOL) |
| PCN-2560 | 2021-12-16 | 2021-12-16 | Additional Wafer Source (GFAB) and Additional Assembly and Test Site (SAT) |
