Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.
3D-image-X3-WLB1608-2.png2A SCHOTTKY BARRIER RECTIFIER CHIP SCALE PACKAGE
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The SDM2U30CSP is a 30-volt 2A Schottky Barrier Rectifier that is optimized for low forward voltage drop and low leakage current, housed in a compact chip scale package (CSP) that occupies only 1.28mm2 board space with low profile. The low thermal resistance enables designers to meet design challenges of increasing efficiency whilst at the same time reducing board space. It is ideally suited for use in portable applications as a:
| AEC Qualified | No |
|---|---|
| Compliance (Only Automotive supports PPAP) | Standard |
| Configuration | Single |
| MaximumAverageRectifiedCurrent IO (A) | 2 A |
| @ TerminalTemperature TT (ºC) | N/A ºC |
| Peak RepetitiveReverse VoltageVRRM (V) | 30 V |
| Peak ForwardSurge CurrentIFSM(A) | 28 A |
| Forward VoltageDrop VF(V) | 0.48 V |
| @ IF (A) | 2 A |
| Maximum ReverseCurrent IR (µA) | 150 µA |
| @ VR (V) | 30 V |
| TotalCapacitance CT (pF) | 110 pF |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2560 | 2021-12-16 | 2021-12-16 | Additional Wafer Source (GFAB) and Additional Assembly and Test Site (SAT) |
