Diodes Incorporated — Analog and discrete power solutions
SMA

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.

SMA.png
Back to Zener TVSs

SMAJ130A

400W Surface Mount Transient Voltage Suppressor

Contact Sales

Log in or register to manage email notifications about changes to datasheets or PCNs for this part.

Product Specifications

Product Parameters

AEC Qualified No
Compliance (Only Automotive supports PPAP) Standard
Configuration Single (Uni-Directional)
Power Rating (W) 400 W
Reverse Standoff Voltage VRWM(V) 130 V
Breakdown VoltageVBR Min(V) 144 V
BreakdownVoltageVBR Max (V) 159 V
Maximum Reverse Leakage CurrentIR @ VRWM Max (µA) 5 µA
Maximum Clamping Voltage @ Max Peak Pulse Current VC (V) 209 V

Related Content

Packages

Technical Documents

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2701 2024-11-18 2025-02-17 Transfer of Wafer Manufacturing Site and Additional Wafer Source for Select Discrete Products
PCN-2588 2022-06-01 2022-09-01 Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound, and Qualification of Additional
Diodes Internal Assembly & Test Site (SSEC) for Select Discrete Products
PCN-2524 2021-10-04 2022-01-04 Wafer Diameter Change from 4 inch to 5 inch at Yea Shin Technology Co., Ltd. (Yeashin Fab) and Qualification of Yea Shin
Technology Co., Ltd. as Additional Wafer Source on Select Products
PCN-2542 2021-08-30 2021-11-30 Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Discrete Products in SMA Package
PCN-2398 2019-05-21 2019-08-21 Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Products
PCN-2337 2018-06-04 2018-05-04 Qualification of Additional Wafer Sources and Additional Assembly and Test Sites for Select Products