Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.
SMB.png600W Surface Mount Transient Voltage Suppressor
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| AEC Qualified | No |
|---|---|
| Compliance (Only Automotive supports PPAP) | Standard |
| Configuration | Single (Uni-Directional) |
| Power Rating (W) | 600 W |
| Reverse Standoff Voltage VRWM(V) | 45 V |
| Breakdown VoltageVBR Min(V) | 50 V |
| BreakdownVoltageVBR Max (V) | 57.5 V |
| Maximum Reverse Leakage CurrentIR @ VRWM Max (µA) | 5 µA |
| Maximum Clamping Voltage @ Max Peak Pulse Current VC (V) | 72.7 V |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2701 | 2024-11-18 | 2025-02-17 | Transfer of Wafer Manufacturing Site and Additional Wafer Source for Select Discrete Products |
| PCN-2588 | 2022-06-01 | 2022-09-01 | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound, and Qualification of Additional Diodes Internal Assembly & Test Site (SSEC) for Select Discrete Products |
| PCN-2524 | 2021-10-04 | 2022-01-04 | Wafer Diameter Change from 4 inch to 5 inch at Yea Shin Technology Co., Ltd. (Yeashin Fab) and Qualification of Yea Shin Technology Co., Ltd. as Additional Wafer Source on Select Products |
| PCN-2398 | 2019-05-21 | 2019-08-21 | Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Products |
| PCN-2337 | 2018-06-04 | 2018-05-04 | Qualification of Additional Wafer Sources and Additional Assembly and Test Sites for Select Products |
