Diodes Incorporated — Analog and discrete power solutions
SOD123F

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SOD123F

SOD123F

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SOD123F

SOD123F

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SOD123F

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US1DWFQ

1.0A SURFACE MOUNT ULTRA-FAST RECTIFIER

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Description

The US1DWFQ is a rectifier packaged in the SOD123F package and is suited as a boost diode in power factor correction circuitry. For use in secondary rectification and freewheeling for ultra-fast switching speed AC-AC and DC-DC converters in high-temperature conditions for consumer applications.

Feature(s)

  • Low Profile, Small Form Factor Package
  • Low Leakage Current
  • Glass Passivated Die Construction
  • Enhanced Ultrafast Recovery Times for High Efficiency
  • Low Forward Voltage, Low Power Loss
  • Lead-Free Finish & RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • Qualified to AEC-Q101 Standards for High Reliability
  • PPAP Capable (Note 4)

Application(s)

  • Flat Panel Display
  • Switching Power Supplies/Chargers
  • LED Lighting
  • Freewheeling Diode
  • Automotive

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP) Automotive
AEC Qualified Yes
Product Type ULTRA-FAST RECOVERY RECTIFIER
Configuration Single
MaximumAverageRectifiedCurrent IO (A) 1 A
Maximum Peak Forward Surge Current IFSM (A) 30 A
Peak RepetitiveReverse VoltageVRRM (V) 200 V
Forward VoltageDrop VF(V) 0.95 V
@ IF (A) 1 A
Maximum ReverseCurrent IR (µA) 5 µA
@ VR (V) 200 V
Reverse RecoveryTime trr (ns) 35 ns
TotalCapacitance CT (pF) 14 pF

Related Content

Packages

Technical Documents

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Purchase & Availablity

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2702 2024-11-18 2025-02-17 Transfer of Wafer Manufacturing Site and Additional Wafer Source for Select Automotive Products
PCN-2619 2023-04-12 2023-07-12 Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products
PCN-2500 2021-03-24 2021-06-24 Transfer Final Test and Packing from Eris Plant 1 in Taipei City, Taiwan to Eris Plant 2 in Taoyuan, Taiwan for
Automotive Products