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SOD123F.png1.0A SURFACE MOUNT ULTRA-FAST RECTIFIER
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| Compliance (Only Automotive supports PPAP) | Standard |
|---|---|
| AEC Qualified | No |
| Product Type | ULTRA-FAST RECOVERY RECTIFIER |
| Configuration | Single |
| MaximumAverageRectifiedCurrent IO (A) | 1 A |
| Maximum Peak Forward Surge Current IFSM (A) | 30 A |
| Peak RepetitiveReverse VoltageVRRM (V) | 400 V |
| Forward VoltageDrop VF(V) | 1.25 V |
| @ IF (A) | 1 A |
| Maximum ReverseCurrent IR (µA) | 1 µA |
| @ VR (V) | 400 V |
| Reverse RecoveryTime trr (ns) | 35 ns |
| TotalCapacitance CT (pF) | 9 pF |
A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.
| PCN # | Issue Date | Implementation Date | Subject |
|---|---|---|---|
| PCN-2701 | 2024-11-18 | 2025-02-17 | Transfer of Wafer Manufacturing Site and Additional Wafer Source for Select Discrete Products |
| PCN-2588 | 2022-06-01 | 2022-09-01 | Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound, and Qualification of Additional Diodes Internal Assembly & Test Site (SSEC) for Select Discrete Products |
| PCN-2398 | 2019-05-21 | 2019-08-21 | Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Products |
| PCN-2337 | 2018-06-04 | 2018-05-04 | Qualification of Additional Wafer Sources and Additional Assembly and Test Sites for Select Products |
