Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details. SOD123F

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US1GWFQ

1.0A SURFACE MOUNT ULTRA-FAST RECTIFIER

Datasheet

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Description

The US1GWFQ is a rectifier packaged in the SOD123F package and is suited as a boost diode in power factor correction circuitry. The device is for use in secondary rectification and freewheeling for ultra-fast switching speed AC-AC and DC-DC converters in high-temperature conditions for consumer applications.

Feature(s)

Low Profile, Small Form Factor Package
Very Low Leakage Current
Glass Passivated Die Construction
Enhanced Ultra-fast Recovery Times for High Efficiency
Low Forward Voltage, Low Power Loss
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
The US1GWFQ is suitable for automotive applications requiring specific change control; this part is AEC-Q101 qualified, PPAP capable, and manufactured in IATF 16949 certified facilities.

https://www.diodes.com/quality/product-definitions/

Application(s)

Flat panel displays
Switching power supplies/chargers
LED lighting
Freewheeling diodes
Automotive

Specifications & Technical Documents

Product Parameters

Compliance (Only Automotive Supports PPAP)	Yes
AEC Qualified	Yes
Product Type	ULTRA-FAST RECOVERY RECTIFIER
Configuration	Single
MaximumAverageRectifiedCurrent I_O(A)	1 A
Maximum Peak Forward Surge Current I_{FSM (A)}	30 A
Peak RepetitiveReverse VoltageV_RRM(V)	400 V
Forward VoltageDrop V_F(V)	1.25 V
@ I_F(A)	1 A
Maximum ReverseCurrent I_R(µA)	1 µA
@ V_R(V)	400 V
Reverse RecoveryTime trr (ns)	35 ns
TotalCapacitance C_T(pF)	9 pF

Technical Documents

Recommended Soldering Techniques

TN1.pdf

Purchase & Availablity

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2702	2024-11-18	2025-02-17	Transfer of Wafer Manufacturing Site and Additional Wafer Source for Select Automotive Products