Diodes Incorporated — Analog and discrete power solutions
D FLat A

Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.

D-FLat-A.png
Back to Fast/Ultra-Fast Rectifiers

US1MDFQ

1.0A SURFACE MOUNT ULTRA-FAST RECTIFIER

Contact Sales

Log in or register to manage email notifications about changes to datasheets or PCNs for this part.

Description

The US1MDFQ is a rectifier packaged in the low profile D-FLAT package. Providing ultra-fast recovery time for high efficiency, this device is ideal for use in applications.

Feature(s)

  • Glass Passivated Die Construction
  • Fast Recovery Time for High Efficiency
  • Surge Overload Rating to 30A Peak
  • High Current Capability
  • Low Profile Design, Package Height Less than 1.1mm
  • Lead-Free Finish; RoHS Compliant
  • Halogen and Antimony Free. “Green” Device
  • Qualified to AEC-Q101 Standards for High Reliability
  • PPAP Capable

Application(s)

  • Reverse Protection
  • Switching
  • Blocking

Product Specifications

Product Parameters

Compliance (Only Automotive supports PPAP) Automotive
AEC Qualified Yes
Product Type ULTRA-FAST RECTIFIER
Configuration Single
MaximumAverageRectifiedCurrent IO (A) 1 A
Maximum Peak Forward Surge Current IFSM (A) 30 A
Peak RepetitiveReverse VoltageVRRM (V) 1000 V
Forward VoltageDrop VF(V) 1.7 V
@ IF (A) 1 A
Maximum ReverseCurrent IR (µA) 5 µA
@ VR (V) 1000 V
Reverse RecoveryTime trr (ns) 75 ns
TotalCapacitance CT (pF) 10 pF

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2702 2024-11-18 2025-02-17 Transfer of Wafer Manufacturing Site and Additional Wafer Source for Select Automotive Products
PCN-2619 2023-04-12 2023-07-12 Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound for Select Automotive Products
PCN-2500 2021-03-24 2021-06-24 Transfer Final Test and Packing from Eris Plant 1 in Taipei City, Taiwan to Eris Plant 2 in Taoyuan, Taiwan for
Automotive Products
PCN-2404 2019-05-21 2019-08-21 Transfer Assembly Lines to Eris Assembly Site (Plant 2) in Taoyuan, Taiwan from the Existing Assembly Site (Plant 1) in Taipei City, Taiwan for Select Discrete Automotive Products
PCN-2341 2019-02-27 2019-05-27 Qualification of Additional Wafer Source for Select Automotive
Products