ZLLS410

Schottky

Datasheet

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Description

This compact SOD323 packaged Schottky diode offers users an excellent performance combination comprising high-current operation, extremely low-leakage and low-forward voltage ensuring suitability for applications requiring efficient operation at higher temperatures (above +85°C) see Operational Efficiency Chart on page 3.

Feature(s)

Extremely Low Leakage
High-Current Capability
Low V_F, Fast Switching Schottky
SOD323 Package
Package Thermally Rated to +150°C
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
For automotive applications requiring specific change control (i.e.: parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please refer to the related automotive grade (Q-suffix) part. A listing can be found at https://www.diodes.com/products/automotive/automotiveproducts/.
This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/

Application(s)

Low power DC-DC conversions
Level shifting
Reverse blockings

Product Specifications

Product Parameters

AEC Qualified	Yes
Compliance (Only Automotive supports PPAP)	Standard
Configuration	Single
MaximumAverageRectifiedCurrent I_O(A)	0.75 A
@ TerminalTemperature TT (ºC)	N/A ºC
Peak RepetitiveReverse VoltageV_RRM(V)	10 V
Peak ForwardSurge CurrentI_FSM(A)	4 A
Forward VoltageDrop V_F(V)	0.38 V
@ I_F(A)	0.1 A
Maximum ReverseCurrent I_R(µA)	6 µA
@ V_R(V)	10 V
TotalCapacitance C_T(pF)	26 pF

Technical Documents

SPICE Model

ZLLS410.spice.txt

MDS Reports

MDSSOD323.pdf (45 KB)

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

RoHSFile

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2670	2024-02-20	2024-05-20	Part Marking Change
PCN-2562	2022-01-04	2022-04-04	Qualification of Additional Wafer Back Grinding and Back Metal Process Source (GFAB) for Select Discrete Products