Image shown is for reference only. Actual package may vary. Refer to the product data sheet for package details.

SO-8.png

Back to MOSFET Master Table

DMC6040SSD

COMPLEMENTARY PAIR ENHANCEMENT MODE MOSFET

Datasheet

Contact Sales

Description

This new generation MOSFET has been designed to minimize the on-state resistance (R_DS(ON)) yet maintain superior switching performance, making it ideal for high-efficiency power-management applications.

Feature(s)

Low Input Capacitance
Low On-Resistance
Fast Switching Speed
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/
An automotive-compliant part is available under separate datasheet (DMC6040SSDQ)

Application(s)

DC-DC converters
Power-management functions
Backlighting

Product Specifications

Product Parameters

AEC Qualified	Yes
Compliance (Only Automotive(Q) supports PPAP)	Standard
Polarity	N+P
ESD Diodes (Y\|N)	No
\|V_DS\| (V)	60, 60 V
\|V_GS\| (±V)	20, 20 ±V
\|I_DS\| @T_A = +25°C (A)	6.5, 3.9
P_D @T_A = +25°C (W)	1.56
R_DS(ON)Max@ V_GS(10V)(mΩ)	40, 110 mΩ
R_DS(ON)Max@ V_GS(4.5V)(mΩ)	55, 130 mΩ
\|V_GS(TH)\| Max (V)	3, 3 V
Q_G Typ @ \|V_GS\| = 4.5V (nC)	9.4, 9.5 nC
Q_G Typ @ \|V_GS\| = 10V (nC)	20.8, 19.4 nC
C_ISS Typ (pF)	1130, 1030 pF
C_ISS Condition @\|V_DS\| (V)	15, 15 V

Technical Documents

SPICE Model

DMC6040SSD.spice.txt

Recommended Soldering Techniques

TN1.pdf

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN #	Issue Date	Implementation Date	Subject
PCN-2425	2019-10-04	2020-01-04	Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, and Additional Wafer Source for Select Products.
PCN-2403	2019-03-25	2019-06-19	Qualification of Additional Wafer Solderable Front Metal Plating, Back Grinding and Back Metal Process Source, Additional Wafer Source, or Additional Assembly and Test site for Select Products.