Diodes Incorporated
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SDM20U40

Schottky

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Feature(s)

  • Low Forward Voltage Drop
  • Guard Ring Construction for Transient Protection
  • Negligible Reverse Recovery Time
  • Low Reverse Capacitance
  • Ultra-Small Surface-Mount Package
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3)
  • This part is qualified to JEDEC standards (as references in AEC-Q) for High Reliability. https://www.diodes.com/quality/product-definitions/
  • An automotive-compliant part is available under separate datasheet (SDM20U40Q)

Product Specifications

Product Parameters

AEC Qualified Yes
Compliance (Only Automotive supports PPAP) Standard
Configuration Single
Power Rating(mW) 150 mW
Peak RepetitiveReverse VoltageVRRM (V) 40 V
Forward Continuous Current IFM (mA) 250 mA
Forward VoltageDrop VF(V) 0.37
@ IF(mA) 20 mA
Maximum ReverseCurrent IR (µA) 5 µA
@ VR (V) 30 V
Capacitance CTOT Typ (pF) 50 pF

Related Content

Packages

Technical Documents

SPICE Model

Recommended Soldering Techniques

TN1.pdf

RoHS CofC

Product Change Notices (PCNs)

A PCN may only apply to specific orderable part numbers in this datasheet. Please refer to the corresponding PCN to see the exact orderable part number(s) affected.

PCN # Issue Date Implementation Date Subject
PCN-2660 2024-03-13 2024-06-13 Qualification of Additional Wafer Source with Wafer Diameter and Mold Compound Changes for Select Discrete Products
PCN-2495 2021-03-31 2021-07-01 Qualification of Additional Assembly & Test Sites and Additional Wafer Back Grinding and Back Metal Process
Source for Select Discrete Products
PCN-2461 2020-05-08 2021-04-05 Phenitec Wafer Manufacturing Site Change, Additional Wafer Sources, Wafer Diameter Change, Additional Assembly and Test Site