Tag: Outline Packages Filter by Year 2024 2023 2022 2021 2020 2019 2018 2017 Filter by Category Automotive Applications Life at Diodes Sustainability Technology Filter by Tag AC-DC Converters ADAS Analog Products Audio Automotive Automotive Applications Engineering BLDC Boost Controller Boost Converters Brushed Motors Brushless DC Buck Converters Cameras Class-D Clocks Communications Computing Constant Current Driver Crossbar Switches Crystal Oscillators Crystals Current Monitors Discrete Products Displays Electric Control Units (ECUs) Electrical Energy EMI Energy Efficiency Ethernet GPIO Expanders Hall Effect Switches Home Appliances Hot Swapping HVAC Applications I/O Interfaces IIoT Industrial IntelliFET Internships IO Expanders IoT IT Security LAN Signal Switches LDO LED LED Driver LED Drivers LED Lighting Load Switches Logic MIPI MIPI Switching MOSFETs Offline Power Online Appliances Op Amps Outline Packages Packaging Packet Switches Passive Signal Switches PCI Switches PCIe 2.0 PCIe 2.0 Packet Switches PCIe 3.0 PCIe 3.0 Packet Switches Peripheral Drivers Plug & Play PoL Converters Port Expanders Power Power Delivery Power Switches Powertrain Process Engineering Process Integration Engineering Protocol Switches PSU ReDrivers SBR SBRT Schottky Rectifiers Seam Seal Sink Controllers Smartphones STEM Careers Sustainability Report Switches Switching Converters Synchronous Rectification Telematics Timing Transistors USB USB Type-C Voltage Regulation Women’s Leadership Initiative Year in Industry (YINI) 麻雀雖小、五臟俱全的小外形封裝 Posted in Technology; Tagged Discrete Products, IIoT, IoT, Outline Packages, Packaging; Posted 5 years 以前 by Shane Timmons | Product Marketing Manager 作者:Diodes 公司產品行銷經理 Shane Timmons 輕巧封裝的趨勢依舊持續戈登.摩爾 (Gordon Moore) 對積體電路 (IC) 元件密度不斷增長的先知灼見仍被證明是正確的。即使近年來這樣的成長已經趨緩,但輕巧封裝的趨勢仍快速持續著。 Read More